Job description
Process & Equipment Technician
(Wire Bond / Die Attach / FOL or EOL Experience)
Job Description :
- To maintain production equipments to the optimum effectiveness
- Device setup/Parameter setting
- Mapping system setting
- Shift machine top alarm analysis
- Quality issue analysis
- Machine/Oven device change/conversion, machine trouble shooting, shift check
- High pressure oven device change, machine trouble shooting, shift check
- Daily & Weekly PM
- Familiar with semiconductor equipment (Front End or Back End)
- Familiar with semiconductor processes and monitoring such (Front End or Back End)
- Have knowledge and hands on machine example Kaijo and ASM 829, FOL and EOL, Asymentek,
Requirements :
- Candidate must possess minimum 3 yrs experience, Diploma /Degree Fresh in Engineering
- Able to do simple presentation
- Possess a reasonable working knowledge in the related practices in the industry
- Able to use computer and familiar with MS Office – Words/Excel for reports
- Technical Skills such as DA (Die-Attach), WB (Wire Bond), FOL and EOL/ NPI
- Able to read, write and converse in English and Bahasa Malaysia
- Good communication & interpersonal skills
- Applicants must be willing to work in Bayan Lepas, Penang.
- Full-Time position(s) available.
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